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US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Electronic device including thermal interface material" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,449, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Electronic device including thermal interf... Read More


US Patent Issued on April 21 for "Circuit, circuit board, and heat sink assembly for retrofitting a lighting system with LED lights" (Iowa Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,450, issued on April 21. "Circuit, circuit board, and heat sink assembly for retrofitting a lighting system with LED lights" was invented ... Read More


US Patent Issued to AT&S Austria Technologie & Systemtechnik on April 21 for "Component carrier with an embedded thermally conductive block and manufacturing method" (Austrian Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,451, issued on April 21, was assigned to AT&S Austria Technologie & Systemtechnik AG (Leoben, Austria). "Component carrier with an embedde... Read More


US Patent Issued to Microsoft Technology Licensing on April 21 for "Microfluidic printed circuit board cooling" (Washington Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,452, issued on April 21, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "Microfluidic printed circuit board cooling"... Read More


US Patent Issued to Delta Electronics (Shanghai) on April 21 for "Vertical power supply system and manufacturing method of connection board" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,453, issued on April 21, was assigned to Delta Electronics (Shanghai) Co. LTD. (Shanghai). "Vertical power supply system and manufacturing... Read More


US Patent Issued to BOARDTEK ELECTRONICS on April 21 for "Circuit board and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,454, issued on April 21, was assigned to BOARDTEK ELECTRONICS Corp. (Taoyuan City, Taiwan). "Circuit board and manufacturing method thereo... Read More


US Patent Issued to Sandisk Technologies on April 21 for "Shock absorber assembly for a printed circuit board" (Malaysian, American Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,455, issued on April 21, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Shock absorber assembly for a printed circuit boar... Read More


US Patent Issued to Chengdu BOE Optoelectronics Technology, BOE Technology Group on April 21 for "Flexible circuit board, display panel and method for manufacturing same, and display device" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,456, issued on April 21, was assigned to Chengdu BOE Optoelectronics Technology Co. Ltd. (Chengdu, China) and BOE Technology Group Co. Ltd.... Read More


US Patent Issued to MAGNOLIA WHITE on April 21 for "Stretchable device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,457, issued on April 21, was assigned to MAGNOLIA WHITE Corp. (Tokyo). "Stretchable device" was invented by Takumi Sano (Tokyo) and Masato... Read More


US Patent Issued to LG INNOTEK on April 21 for "Flexible printed circuit board, COF module, and electronic device comprising the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,458, issued on April 21, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Flexible printed circuit board, COF module, and electr... Read More